Orilind Limited Company
Dual In-line Package Also known as DIP package, Short name is DIP or DIL, is an integrated circuit package, the outline of the integrated circuit is rectangular, on both sides of the There are two parallel rows of metal pins called pin headers. DIP packaged components can be soldered into plated through-holes in a Printed Circuit Board or inserted into DIP sockets.
Our engineering team has extensive experience in DFM/DFA/DFT technologies. SMT, BGA Rework, Re-balling, X-Ray are all readily achievable