Orilind Limited Company
Model No.: T4S019055A0
Dual In-line Package (DIP) is one of the plug-in package. The chip package is basically DIP package. This package has the characteristics of suitable for PCB (Printed Circuit Board) punching installation, wiring and operation more convenient. The DIP package is available in a variety of configurations, including multilayer ceramic dual in-line DIPs, single-layer ceramic dual inline DIPs, and lead frame DIPs. Leads are drawn from both sides of the package and are available in plastic and ceramic. DIP is the most popular cartridge type package and its applications include standard logic ICs, memory LSIs, and microcomputer circuits.