Orilind Limited Company
Model No.: TP8W65015A
Multilayer rigid gold plating Circuit Board. Surface treatment Hard Gold plating, AU: 10U",NI: 118-236u". Inner layer 2oz and outer layer 2oz. Min hole copper thickness according to IPC-III, min 25um. FR4 S-1000-2, TG170. board thickness 3.2mm. Green soldermask and white silkscreen.
Our General Capabilities: Can be 1-40 Layers rigid board and 1-12 layers flexible circuit board.
Surface treatment(surface finished) can be: HASL, Lead-free HASL, Hard Gold plating, Immersion Gold, Immersion Silver, Immersion Tin, OSP and the Options: Gold Tabs, Selective Au, Carbon Ink, Peelable Mask, Micro Via, Controlled Impedance, Score, LASER Drill, Blind Vias and Buried Vias.
And the soldermask colour can be: green, bule, white,black, red, yellow, orange, matt-green(semi green), matt-black. The silkscreen colour can be: white, black, yellow.
Copper thickness can be: 1-10 oz Outer and 0.5-8 oz inner.