Double side Immersion Gold Circuit Board without soldermask. Copper thickness 3oz finished. immersion gold 4U". Base material FR4 S1000-2. board thickness 2.0mm.
The purpose of the Immersion Gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth plating, and good solderability on the surface of the printed circuit. Basically can be divided into four stages: pre-treatment (degreasing, micro-etching, activation, post-dip), nickel, gold, post-treatment (waste water washing, DI washing, drying)
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Product Categories : PCB Surface Treatment > Immersion Gold