Orilind Limited Company
10-layer Mobile Phone PCB Board, Base Material: FR4 TG180. inner/outer copper thickness 0.5/1 oz. Immersion Gold surface treatment with green colour solder mask. Board thickness 1.2 mm. Min.line width/Min.line spacing 0.75/0.75 mm. 4-up connect with the routed&mouse bit, 100% E-test pass. Have L1-L3, L8-L10 blind micro vias and L3-L8 buried holes. Vias in pad need to be filled with resin and copper cap. the distance between BGA PIN spacing only 0.4 mm. With impedance control.