Company Details

  • Orilind Limited Company

  •  [Guangdong,China]
  • Business Type:Manufacturer , Agent , Service , Trade Company
  • Main Mark: Africa , Americas , Asia , Caribbean , East Europe , Europe , Middle East , North Europe , Oceania , Other Markets , West Europe , Worldwide
  • Certs:ISO/TS16949, ISO14001, ISO9001, EMC, RoHS, Test Report, UL
  • Description:Mobile Phone PCB Board,PCB Board,Printed Circuit Board,Mobile Phone Circuit Board
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Orilind Limited Company

Mobile Phone PCB Board,PCB Board,Printed Circuit Board,Mobile Phone Circuit Board

Home > Products > Electronic Products > Mobile Phone PCB Board

Mobile Phone PCB Board

Product categories of Mobile Phone PCB Board, we are specialized manufacturers from China, Mobile Phone PCB Board, PCB Board suppliers/factory, wholesale high-quality products of Printed Circuit Board R & D and manufacturing, we have the perfect after-sales service and technical support. Look forward to your cooperation!
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Consumer electronic circuit board
  • Model No.: TP6W61025A

6-layer Consumer electronic circuit board. Base Material: S1000-2, FR4 TG170. inner copper thickness 1 and outer copper thickness 1 oz finished. surface treatment Immersion Gold 3U". With green colour solder mask. Board thickness 1.5 mm....

China Mobile Phone PCB Board of with CE
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Consumer electronic products  PCB
  • Model No.: TP10W63015A

10-layer Mobile Phone PCB board, Base Material: FR4 TG180. inner copper thickness 0.5 and outer copper thickness 1 oz finished. surface treatment Immersion Gold 2U". With green colour solder mask. Board thickness 1.2 mm. Min.track/Min spacing...

China Manufacturer of PCB Board
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China Mobile Phone PCB Board Suppliers

10-layer Mobile Phone PCB Board, Base Material: FR4 TG180. inner/outer copper thickness 0.5/1 oz. Immersion Gold surface treatment with green colour solder mask. Board thickness 1.2 mm. Min.line width/Min.line spacing 0.75/0.75 mm. 4-up connect with the routed&mouse bit, 100% E-test pass. Have L1-L3, L8-L10 blind micro vias and L3-L8 buried holes. Vias in pad need to be filled with resin and copper cap. the distance between BGA PIN spacing only 0.4 mm. With impedance control.

Mobile Phone Pcb Board

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