Orilind Limited Company
Model No.: TP10W63015A
10-layer Mobile Phone PCB Board, Base Material: FR4 TG180. inner copper thickness 0.5 and outer copper thickness 1 oz finished. surface treatment Immersion Gold 2U". With green colour solder mask. Board thickness 1.2 mm. Min.track/Min spacing 0.75/0.75 mm. 4-up connect with the routed&mouse bit, 100% AOI and E-test pass. L1-L3, L8-L10 blind micro vias and L3-L8 buried holes. Vias in pad need to be filled with resin and copper cap. the distance between BGA PIN spacing only 0.4 mm. With impedance control.